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인기있는 뉴스
날짜별 뉴스
전체 : 11,049 ( 1105/1105 페이지)
Component Testing
by Micross - 2013-05-20 15:15 - 11,942 views
One fo engineers testing electronic components
Die and Wafer Storage
by Micross - 2013-05-20 15:14 - 11,660 views
This is a video of one of our storage facilities where we store manufacturer's and customer owned parts.
Wafer Sawing
by Micross - 2013-05-20 15:13 - 14,346 views
This is a wafer being sawn in our disco machine.
Wafer View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,860 views
This the view of our equipment selecting die and picking it from a wafer to be placed into packaging.
Screen View of Auto Pick and Place
by Micross - 2013-05-20 15:13 - 11,877 views
This is the screen view of the equipment identifying and lining up each indivisual die to be picked and placed in it's packaging.
Auto Pick and Place Traying Die
by Micross - 2013-05-20 15:13 - 11,597 views
This is a view of our auto pick and place machine selecting die from a silicon wafer and placing it trays dependent on grade.
Automated Dipping and Solder Exchange
by Micross - 2013-05-20 15:12 - 14,990 views
Micross has designed and developed an automated solder dipping process capable of conforming to GEIA 006. The process includes:- Computer control of a six axis dipping robot. Solder dipping completed under a Nitrogen blanket. Solder level sensing for accurate solder dipping. Integral component wash and dry facility. Preheating of components to negate thermal shock. The automated process is capable of handling most package styles but is not limited to them due to innovative handling fixtures. Typical component packages styles handled to date are: Semiconductors, Passives Electro mechanical components Integral part of process policing includes XRF measurement of the solder baths and were appropriate solderability checking. Solderability Checking in line with NPL best practice.
Mini Circuits at NIWeek 2008
by MiniCircuits - 2013-05-20 15:10 - 16,461 views
Mini-Circuits NEW Power Sensor • Operating frequency range of 1 MHz to 6 GHz • 50 dB dynamic range, -30 dBm to +20 dBm • Good VSWR, 1.1:1 (typical) • Accuracy: ±0.15 dBm (typical) • Linearity at 25 C is ±0.1 dBm (typical) • Measurement speed is 200 ms • No calibration after powering on (plug-in and measure) • No external power supply is needed • 16 simultaneous testing channels • Temperature compensated • Fully loaded power data analysis software • Averaging of measurements • Scheduled data recording • Multi-Sensor support • Interface with test software Only....$695.00
Vitel Booth
by MiniCircuits - 2013-05-20 15:09 - 15,120 views

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